The ADT 8020 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice workpieces of up to 8-inch in diameter, at high performances and low cost of operation.
雙軸晶圓切割機8020系列特點:
Flexibility - Supports Hub and Hubless blades up to 3" O.D.
Spindles of 1.8 kW or 2.4 kW high power (for challenging applications)
Superior vision system with continuous zoom magnification
Intuitive operation interface using a large 19" touch screen monitor