化學鍍又稱為無電解鍍(Electroless plating),也可以稱為自催化電鍍(Autocatalytic plating)[1]。具體過程是指:在一定條件下,水溶液中的金屬離子被還原劑還原,并且沉淀到固態基體表面上的過程。ASTM B374(ASTM,美國材料與試驗協會)中定義為Autocatalytic plating is “deposition of a metallic coating by a controlled chemical reduction that is catalyzed by the metal or alloy being deposited”。這一過程與置換鍍不同,其鍍層是可以不斷增厚的[2],且施鍍金屬本身也具有催化能力。